SYSTEM FEATURES

COMPLETE THERMAL PROCESS CONTROL DURING COMPONENT REPLACEMENT
ELIMINATES THERMAL SHOCK TO SMC ASSEMBLIES BY PREHEATING PCB AT PRESET RAMP RATES
OVERCOME THERMAL MASS OF MULTILAYERS PCBS
AVOID EXCEEDING SUBSTRATE GLASS TRANSITION TEMPERATURES
PREHEAT SOLDER CREAM FOR MAXIMUM FLUXING EFFICIENCY
ENABLE COMPONENT REMOVAL/ PLACEMENT AT LOW TEMPERATURES
STATIC DISSIPATIVE WORK SURFACE

POWER UNIT

SMALL BENCH FOOTPRINT
SELF CONTAINED AIR FLOW SOURCE
SAFETY CUT-OUT FUNCTION